Solder Paste
Solder paste for SMT assembly, available in lead-free, halogen-free and leaded grades, with SAC305 alloy options.
SpecificationsASH manufactures solder paste for SMT electronics assembly, with lead-free, halogen-free and leaded grades. Compare alloys and powder sizes, request technical documents and qualify material on your line.
View independent SGS documentationMatch alloy, powder size and process requirements, supported by grade-specific documents and application guidance.
Start with lead-free and halogen-free solder paste for SMT assembly. Our wider range includes solder wire, solder bar, flux and supporting process materials.
Solder paste for SMT assembly, available in lead-free, halogen-free and leaded grades, with SAC305 alloy options.
Specifications
High-purity solder bar with exceptional flow and special antioxidants for reduced dross and oxidation.
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High-purity rosin-core wire for smooth application, strong wetting, low smoke and minimal splatter.
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A clean-peel protective coating for touchscreens, PET, ITO film and ITO glass.
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High-temperature epoxy adhesive with excellent thixotropy, insulation and thermal-shock resistance.
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Thermally conductive silicone compound with low oil separation and wide temperature resistance.
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Active wetting formulations that remove oxides and support bright, full, reliable solder joints.
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Purpose-designed cleaners for PCBA, stencil and production-equipment residues.
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A transparent protective shield against moisture, dust, salt spray and chemical corrosion.
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Defined controls connect incoming materials, production parameters, final inspection and documentation.
Raw materials are checked against defined acceptance requirements before production.
Key formulation and production parameters are monitored for repeatability.
Visual, performance and compliance checks support batch release decisions.
Lot identification and supporting documentation connect material to delivery.
Material selection starts with process conditions, reliability targets and the realities of your production line.
High reliabilityAutomotive ElectronicsPower modules, control systems and high-reliability assemblies.
Fine-pitch readyCommunicationsConsistent printing and wetting for dense communication hardware.
Volume productionConsumer ElectronicsRepeatable performance for high-volume appliances and smart devices.
Thermal controlNew EnergyLow-voiding alloys and thermal materials for charging and energy systems.
Process stabilityIndustrial ControlProtective chemistries for harsh environments and long service life.
Download available SGS reports, review the nine-step quality process and speak with our technical team before qualification.
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Read articleShare your alloy, stencil printing process, powder size and production requirements. Our team can help identify a solder paste grade to evaluate on your line.