Material performance
Key Features
- Fast thermal cure
- Excellent thixotropy
- Electrical insulation
- Thermal-shock resistance
- Printing and dispensing grades
ASH / 05Engineered Material
Multiple packaging optionsRepresentative product image
Fast-Curing SMD Epoxy
Red Glue
High-temperature epoxy adhesive with excellent thixotropy, insulation and thermal-shock resistance.
ASH chip red glue is a single-component, fast-curing epoxy adhesive for bonding SMD components to printed circuit boards. It provides excellent thixotropy, thermal shock resistance and electrical insulation.
ControlledBatch quality
DocumentedSGS evidence
ResponsiveProcess support
01
Performance profile
Built Around the Process
Material behavior and application fit are considered together, helping teams qualify the right grade for their line instead of selecting by part number alone.
Production fit
Applications
- SMD component bonding
- Manual stencil printing
- Thick-board printing
- Automated dispensing
02
Representative grades
Technical Range
Use these values for initial comparison. ASH will confirm the current technical data sheet, packaging format and process recommendation for the selected grade.
| Series | Color / State | Viscosity | Curing | Application |
|---|---|---|---|---|
| NE6000G | Red Paste | 480±10% | 120 sec @ 150°C | Stencil / thick board |
| NE6000D | Red Paste | 350±10% | 120 sec @ 150°C | Dispensing |
| NE4106G | Red Paste | 530±10% | 120 sec @ 120°C | Low-temp stencil |
| NE4106D | Red Paste | 400±10% | 120 sec @ 120°C | Low-temp dispensing |
Specifications shown are representative and may be updated as products develop. Contact ASH before production approval.
Quality and compliance evidence is product- and grade-specific. Review the available SGS reports and request the current technical data sheet, safety data sheet and lot documentation for your qualification.
03 / Handling guidance
Protect Performance from Storage to Use
- 01
Store at 2–8°C; shelf life is 6 months.
- 02
Return refrigerated material to room temperature before use.
- 03
Do not return used glue to the original package.
- 04
Minimize exposure to air and control humidity.