Material performance
Key Features
- Excellent continuous printability
- Superior wettability and solder climbing
- Low voiding rates
- Transparent residues
- Low-halogen and zero-halogen options
ASH / 01Engineered Material
Multiple packaging optionsRepresentative product image
Lead-Free · Halogen-Free · Leaded
Solder Paste for SMT Assembly
Solder paste for SMT assembly, available in lead-free, halogen-free and leaded grades, with SAC305 alloy options.
ASH manufactures solder paste from spherical solder alloy powder and a stable flux system. The range supports stencil printing and reflow soldering for electronics assembly, with grades designed for continuous printability, wetting and low voiding. Choose the alloy and powder size to match your assembly process, then confirm the current grade-specific technical data before qualification.
ControlledBatch quality
DocumentedSGS evidence
ResponsiveProcess support
01
Performance profile
Solder Paste for Your SMT Process
Compare printability, wetting and application fit before choosing a solder paste grade. Technical support can help match the alloy and powder size to your stencil printing and reflow process.
Production fit
Applications
- Home appliances
- Network communication equipment
- Electrical appliances
- Smartphones
- Electronic modules
02
Representative grades
Solder Paste Grades & Specifications
Use these values for initial comparison. ASH will confirm the current technical data sheet, packaging format and process recommendation for the selected grade.
Lead-Free & SAC305 Solder Paste
Compare SAC305 grades such as ASH SAC305 VXG and GM2-980-VC with lower-silver lead-free alloys in the technical range below.
- Select the alloy composition for your assembly requirements.
- Compare the available powder sizes and viscosity by grade.
Halogen-Free Solder Paste
ASH SAC305VHF and GLH-980-VW are halogen-free solder paste options with the SnAg3.0Cu0.5 alloy composition.
- Review grade-specific SGS reports and current technical documents.
- Confirm the formulation and process fit before qualification.
Leaded Solder Paste
GMR-470-VG uses the Sn63Pb37 alloy. Review its powder size, viscosity and melting point alongside the lead-free range.
- Discuss your end-product requirements with the technical team.
- Request the current safety data sheet and handling guidance.
| Model | Alloy Composition | Powder Size | Viscosity (Pa·s) | Melting Point (°C) |
|---|---|---|---|---|
| ASH SAC305 VXG | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217–220 |
| GM2-980-VH | SnAg3.0Cu0.5 | 3#, 4#, 5# | 200±30 | 217–220 |
| GM2-980-VC | SnAg3.0Cu0.5 | 3#, 4# | 160±30 | 217–220 |
| AFM-980-V4 | SnAg3.0Cu0.5 | 3#, 4# | 200±30 | 217–220 |
| GM2-960-VH | SnAg1.0Cu0.5 | 3#, 4#, 5# | 200±30 | 217–227 |
| GM2-910-VH | SnAg0.3Cu0.7 | 3#, 4#, 5# | 200±30 | 217–227 |
| ASH SAC305VHF | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217–220 |
| GLH-980-VW | SnAg3.0Cu0.5 | 4#, 5#, 6# | 200±30 | 217–220 |
| GMR-470-VG | Sn63Pb37 | 3#, 4# | 200±30 | 183 |
Specifications shown are representative and may be updated as products develop. Contact ASH before production approval.
Quality and compliance evidence is product- and grade-specific. Review the available SGS reports and request the current technical data sheet, safety data sheet and lot documentation for your qualification.
03 / Handling guidance
Protect Performance from Storage to Use
- 01
Store for up to 6 months at 0–10°C.
- 02
Allow sealed paste to return to room temperature for 2–4 hours before use.
- 03
Mix for 1–3 minutes before printing and keep stencils and tools clean.
- 04
Mount components within 2 hours after printing.