Material performance
Key Features
- Good fluidity
- Less dross
- Low void rate
- Strong solderability
- Special antioxidant formulation
ASH / 02Engineered Material
Multiple packaging optionsRepresentative product image
High-Purity Wave Soldering Alloys
Solder Bar
High-purity solder bar with exceptional flow and special antioxidants for reduced dross and oxidation.
Made with high-purity tin and special antioxidants, ASH solder bar improves tin fluidity and limits oxidation during wave soldering. Pure tin, tin-copper and tin-silver-copper alloys are available for power supplies, appliances, automotive and communication electronics.
ControlledBatch quality
DocumentedSGS evidence
ResponsiveProcess support
01
Performance profile
Built Around the Process
Material behavior and application fit are considered together, helping teams qualify the right grade for their line instead of selecting by part number alone.
Production fit
Applications
- Manual USB material dip soldering
- Wire material dip soldering
- Circuit-board wave soldering
02
Representative grades
Technical Range
Use these values for initial comparison. ASH will confirm the current technical data sheet, packaging format and process recommendation for the selected grade.
| Series | Alloy Composition | Melting Point (°C) |
|---|---|---|
| GM2 900 | Sn99.3Cu0.7 | 217–228 |
| GM2 990 | Sn99.9 | 232 |
| GM2 910 | SnAg0.3Cu0.7 | 217–227 |
| GM2 980 | Sn96.5Ag3.0Cu0.5 | 217–219 |
| GM2 912 | Sn98.8Ag0.5Cu0.7 | 227 |
Specifications shown are representative and may be updated as products develop. Contact ASH before production approval.
Quality and compliance evidence is product- and grade-specific. Review the available SGS reports and request the current technical data sheet, safety data sheet and lot documentation for your qualification.
03 / Handling guidance
Protect Performance from Storage to Use
- 01
Store in a dry, ventilated area.
- 02
Keep alloys clearly identified to avoid cross-contamination.
- 03
Use recommended process temperatures for the selected alloy.